Hitachi Thermo Mechanical Analyzers (TMA): TMA7100

About Hitachi Thermo Mechanical Analyzers (TMA): TMA7100

The Hitachi TMA7100 is a high-precision Thermomechanical Analyzer designed to measure dimensional changes in materials under controlled temperature and mechanical load conditions. With a temperature range from -170C to 600C, it is ideal for analyzing polymers, composites, thin films, and other materials requiring detailed thermal expansion and mechanical property assessments. The TMA7100's ultra-low noise and high sensitivity (0.01 m) make it suitable for detecting minute mechanical changes, even in thin films. Its intuitive NEXTA TA software simplifies operation, allowing both specialists and non-specialists to perform a range of measurements, including creep, stress-relaxation, and dynamic mechanical analysis (DMA), ensuring reliable material analysis.

Note: The price mentioned above is for reference only. Do not consider it for purchase. For the actual price and more product details, please contact us at +91 98508 70860, +91 84461 74263.

• Wide Temperature Range: -170C to 600C, accommodating a broad spectrum of materials. 

• High Sensitivity: 0.01 m resolution for detecting minute dimensional changes.

• Load Range: 5.8 N with a resolution of 9.8 N, allowing precise force application.

• Measurement Range: 5 mm displacement, suitable for various sample sizes. 

• Scan Rate: 0.01 to 100C/min, providing flexibility in thermal analysis.

• Sample Size: Expansion/Penetration: 10L25 mm; Tension: W1T5L25 mm.

• Atmosphere Control: Measurements possible in air, inert gas, or vacuum (to 13 Pa).

• Cooling Options: Liquid nitrogen, electrical cooling, and auto fan cooling units available.

• Software: NEXTA TA software with Simple and Standard modes for user-friendly operation.

• Compliance: Meets ISO, ASTM, DIN, and JIS standards.

Industries Served:

• Polymers and Plastics: Analyzing thermal expansion, softening points, and stress-strain behavior.

• Electronics: Evaluating thermal properties of PCB materials and components.

• Automotive: Assessing material performance under thermal stress.

• Aerospace: Studying materials for thermal stability and expansion.

• Ceramics and Glass: Measuring shrinkage, expansion, and softening temperatures.

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